Macquarie Semiconductor and Technology on behalf of Micron Memory Japan, G.K. (F15)

Tokyo Electron Ltd. (TEL) Telius SP-305 SCCM

Asset ID: 12089

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Tokyo Electron Ltd. (TEL)

Telius SP-305 SCCM

Dielectric Etch

Etch/Ash/Clean - Plasma Processing

Equipment details:

Date of Manufacture: June 17 2005

Currently Configured for: 300mm

Current Equipment Status: Available

Asset HDD not included

Location of Equipment: Hiroshima, Japan

Available date: 3/4/2022

Equipment Type: TELIUS-SCCM[2ch]

Fab15 confirmed there were no missing or damaged parts.


[Chamber A]

Chamber type:SCCM

Gas config. (sccm)=FCS full scale

2line(radical distribution control)

Ar(1420)/C4F6(50.3)/C4F8(43)/C5F8(22.4)

C5F8(38.9)/Xe(487.4)/O2(60.8)/O2(561)

CF4(145)/CHF3(163)/CH2F2(57.7)

RF Top 60MHz, max 5000W

RF Btm 2MHz, max 5000W

Temp Top +40~+120?

Wall +40~+80?

ESC -10~+60?


[Chamber B]

Chamber type:SCCM

Gas config. (sccm)=FCS full scale

2line(radical distribution control)

Ar(1420)/C4F6(50.3)/C4F8(43)/C5F8(22.4)

C5F8(38.9)/Xe(487.4)/O2(60.8)/O2(561)

CF4(145)/CHF3(163)/CH2F2(57.7)

RF Top 60MHz, max 5000W

RF Btm 2MHz, max 5000W

Temp Top +40~+120?

Wall +40~+80?

ESC -10~+60?


OEM  TEL
Tool Model  Telius-SP SCCM
Process  Oxide
Software Version (include revision #) Ver2.90-Rev011-VSTD3.30d
System Power Rating  200 AC 3-Phase
Loading Configuration  3 load port
   Vendor Chm ModelChemicals / Gases Used (not to use Micron Proprietary names)
Chm/Unit Position   1  Loder Module  
Chm/Unit Position   2  Process ship 1Ar,C4F8,O2,CF4,CHF3,CH2F2,N2,He,C5F8,C4F6,Xe
Chm/Unit Position   3  Process ship 2Ar,C4F8,O2,CF4,CHF3,CH2F2,N2,He,C5F8,C4F6,Xe
Description     Qty
Tool:      
Controller:  EC
MC
  1
3
MFC/Pressure Unit:  FCS-DN
FCSWR-DN
627BRETDD2P
627B11TDC2P
  18
4
2
2
Drive Mechanisms:  x-axis: linear motor
y-axis, z-axis, θ: AC servo motor
SINFONIA  1
1
FOUP Opener:  SELOP12F25*  3
Gas System:  Accumulation type(12line) Fujikin  2
Exhuast System:  TMP
DP
  2
0
Chiller:  DAIKIN UBRPD5A-2T2  2


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