Macquarie Semiconductor and Technology on behalf of Micron Memory Taiwan Co., Ltd. (MTB)
Date of Manufacture: 2016
Currently Configured for: N/A
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Taichung City, Taiwan
Available date: Currently Available
INSPSUBST ATI CYPRESS
Description
Inspected Item - Chip on Substrate, Underfill
Handling Carrier – Metal Boat: 60 x 190mm
Magazine: 150~310mm(L) x 31.5~100mm (W)
Handling Product – Singulated Substrate, Common Substrate
2D Item - X/Y Location, Rotation, Tilt, Top side
2D Item (Die Side) – Bondline Measurement
3D Item – Underfill Height, Chip Height
SGS Optic – Micro Crack, Divot
SPC System – Inspection Result Review System
Additional Function – Product Sorting (Screening)
Automation – Factory Full Automation
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Damage/Missing parts list
Brightness controller of 2D measurement need to be exchanged
Please inspect tool to reconfirm
Dry pumps and customer provided items not included on sales
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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