Macquarie Semiconductor and Technology on behalf of Qorvo Costa Rica S.R.L.

TDK / PFA AFM-1501

Asset ID: 210622

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TDK / PFA

AFM-1501

Flip Chip Bonder

Bonder

Equipment details:

Date of Manufacture: 2008

Currently Configured for: N/A

Current Equipment Status: Available

Location of Equipment: Heredia, Costa Rica

Available date: Currently Available

Feature

Accuracy: ±7 um (3 sigma)

Maximum load: 25N

Mounting tact time: 0.8sec/chip (Including 0.2 sec process time)

Option: 50N, 100N

Screw type dispenser

Compression bonding

Wafer magazine auto loading

Air supply: 0.5Mpa, 30NI / min

Power supply: AC 200 V, 50/60 Hz, 30 A, 3 Phase

Product Images

The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.


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