Macquarie Semiconductor and Technology on behalf of Intel Resale Corporation
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Multi Block (Resist Coater/Developer)
Date of Manufacture:
Currently Configured for: 300mm
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Portland, United States
Available date: Currently Available
General:
· 4 Blocks: 1 Carrier, 2 Multi-purpose, 1 Process
· 6 (250 WPH) Transfer Robot arms: 1 Carrier, 2 Multi-purpose, 3 Process
· Stainless Exhaust Lines below Track
· SECS1, SECS11, HMDS & GEM Interface required is iUSC
· E87/GJG compliance
· Single Wafer Block
· Stack 1: No Process Modules – only HMDS Bubblers
· Stack 2: No Process Modules – only HMDS Bubblers
· Stack 3: 12 CADH modules (no spin modules)
· Stack 4: 3 BCT Cups with 10 Nozzles
· Stack 5: 3 BCT Cups with 10 Nozzles
· AC Power Box with Noise filter: CE Mark Type
· AC Power Box 208volts, 3-phase, star, 50/60Hz compatible, SCCR requirements
· Cassette Block (CSB)
· (5) FOUP Loadports (with N2 purge Pre-plumbing)
· Carrier RFID capability on CSB
· CSB Pressure Sensor
· Main Block with 5 Process Stacks
· Stack 1 & 2 No Process Modules or Robotic Arms
o 12 HMDS Bubbler System
· Stack 3 HMDS Processing Only
o 1 Process Robotic Arm
· Stack 4 BARC Processing
o (4) BCT Modules with TCT style cups and backside rinse nozzles
o (10) 1.2 mm Resist nozzles, (1) SRRC nozzle with Temp control per layer
o (10) 0.8 mm Resist nozzles, (1) ARRC nozzle with Temp control per layer
o (10) 3ml CRD resist dispense pumps
o (10) 3ml ACRD resist dispense pumps
o (10) Single Bottle Resist Supply Configuration
o EBR angle adjustment capability
o Bulk-FSI system for solvent dispense
o Exhaust Pressure Control (EPC) per stack
o Exhaust duct and drain case cleaning function
o Exhaust Thermo Controller System in STHC
o 4 Dispense Detection Systems (all COT modules)
o Bevel Rinse nozzle (Ver 2)
o IFF-S for RRC lines with ARRC-s
o IFF-R (for Resist)
· Stack 5 BARC Processing
o (4) BCT Modules with TCT style cups and backside rinse nozzles
o (10) 1.2 mm Resist nozzles, (1) SRRC nozzle with Temp control per layer
o (10) 0.8 mm Resist nozzles, (1) ARRC nozzle with Temp control per layer
o (10) 3ml CRD resist dispense pumps
o (10) 3ml ACRD resist dispense pumps
o (10) Single Bottle Resist Supply Configuration
o EBR angle adjustment capability
o Bulk-FSI system for solvent dispense
o Exhaust Pressure Control (EPC) per stack
o Exhaust duct and drain case cleaning function
o Exhaust Thermo Controller System in STHC
o 4 Dispense Detection Systems (all COT modules)
o Bevel Rinse nozzle (Ver 2)
o IFF-S for RRC lines with ARRC-s
o IFF-R (for Resist)
· (12) Chilling Adhesion Processing Station (CADH)
o Wafer Wedging function using Plate Temperature sensor SW calculation
o (2) Bubbler Type HMDS Tank located in Main processing block
o Gap Pin type UPIMOL proximity pins on chilling arm
· (6) Slim Chill Plate Process Station (SCPL)
o Wafer wedging function using vacuum detection sensor
o Gap Pin type UPIMOL proximity pins on chilling arm
· (2) Chilling High Precision Hot Plate Process Station (CHCH)
o Heated Exhaust Chamber
o Wafer Wedging function using Plate Temperature sensor SW
o Gap Pin type ceramic proximity pins on chilling arm
· (14) General Purpose Hot Plate Process Station (CGCH)
o Heated Exhaust Chamber
o Wafer Wedging function using Plate Temperature sensor SW
o Gap Pin type UPIMOL proximity pins on chilling arm
· (1) TEL System Temp and Humidity Controller (STHC)
o (1) Shinwa unit for system environment control, chemical temperature control and CPL temperature control
o (1) Return Air Box - Plenum
· (2) New Style Chemical Cabinets
o (1) HMDS Canister (3 gallons with gauge)
o (1) 3-Pump Solvent chemical supply system
o (1) Sub operation panel
o Top side facility connection
o CRF for solvent based PCS
· (2) Coater Decks with Ovens
· (1) New Style AC Power Box
o Dual Feed facility supply power with 2 separate breakers
o Top side facility connection
o Ring type GND connection
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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