Macquarie Semiconductor and Technology on behalf of Micron Memory Japan, K.K. (F15)

Tokyo Electron Ltd. (TEL) Tactras Vigus

Asset ID: 12054

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Tokyo Electron Ltd. (TEL)

Tactras Vigus

Dielectric Etch

Etch/Ash/Clean - Plasma Processing

Equipment details:

Date of Manufacture: July 2011

Currently Configured for: 300mm

Current Equipment Status: Available

Asset HDD not included

Location of Equipment: Hiroshima, Japan

Available date: Currently Available

OEM  TEL
Tool Model  Tactras-Vigus
Process  Oxide
Software Version (include revision #) Ver5.05-Rev502-STD-5.05a
System Power Rating  200 AC3-Phase for System
Loading Configuration  3 load port
   Vendor Chm ModelChemicals / Gases Used (not to use Micron Proprietary names)
Chm/Unit Position   1  Loder Module- 
Chm/Unit Position   2  VTMN2 
Chm/Unit Position   3  Purge storage 
Chm/Unit Position   4  Process Module 1  (VIGUS)C4F8,C4F6,CH2F2,COS,O2,CHF3,CF4,CO,N2,Ar,He
Chm/Unit Position   5  Process Module 2  (VIGUS)C4F8,C4F6,CH2F2,COS,O2,CHF3,CF4,CO,N2,Ar,He
Chm/Unit Position   6  Process Module 3  (VIGUS)C4F8,C4F6,CH2F2,COS,O2,CHF3,CF4,CO,N2,Ar,He
Chm/Unit Position   7  Process Module 4  (VIGUS)C4F8,C4F6,CH2F2,COS,O2,CHF3,CF4,CO,N2,Ar,He
Chm/Unit Position   8  Process Module 5  (VIGUS)C4F8,C4F6,CH2F2,COS,O2,CHF3,CF4,CO,N2,Ar,He
Chm/Unit Position   9  Process Module 6  (VIGUS)C4F8,C4F6,CH2F2,COS,O2,CHF3,CF4,CO,N2,Ar,He
Tool:   
Process Unit:  Model:
Controller:  EC
MFC/Pressure Unit:  FCS Device-net I/F Type (Fujikin)
CM1DNARETGAFKNV633 (MKS)
CM2
DMA11TGAEKNN633 (MKS)
Drive Mechanisms:  Yasukawa LMz軸、R軸、H1軸、H2軸、θACサーボモーター
TM
y(スライダ):ACサーボモーター
r
:DDモーター
FOUP Opener:  KWF-12C-T1(K-BL-601HAC1-SO-E)
Gas System:  1.125 inch Accumulation(CKD)
13 + 3(Edge-Add-Gas)
Exhuast System:  TMPTMP-W3503LMC(T4)(VG250)(SHIMADZU)
TM/LLM PUMPMU100U-147 (KASHIYAMA)

Missing parts: Six (6) Bottom chillers.

Defective part: One (1) TM/LLM DRY PUMP.

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