Macquarie Semiconductor and Technology on behalf of Macquarie Electronics USA Inc.
Date of Manufacture:
Currently Configured for: To be determined
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: United States
Available date: Currently Available
IN-LINE GLASS COATING SYSTEM
Located in Clean room
Including 12 Sputter sections, Transport Cabinet, Pump, Power System
Inspect to confirm configuration and condition.
XEA|nova 5.5 WAFER COATING SYSTEM
Subject to change without notice due to technical improvement.
Throughput ≤ 5500 substrates/hour for M6 wafers
Substrates silicon wafers, metal plates, polymer films, others
Substrate size all common formats: M2, M4, M6, M10 and M12
Substrate thickness ≤ 3 mm
Coating area on carrier ≈ (1 x 1.7) m2 , e.g. (6 x 9) for M6 wafers
Magnetron type single or dual rotatable
Sputter arrangement sputter up and sputter down
Deposition type DC, pulsed DC, AC
Number of independent process unlimited
Gases and media e.g. Ar, O2 , N2 , H2 O, X
Target utilization > 80 %, depending on process & material
OPTIONAL PROCESS FEATURES
Pre-treatment (e.g. Ion etching …)
Alternative deposition technologies upon request
Automated substrate loading & unloading
Automated carrier return system
Controlled heating and cooling unit (CHU)
Dry air supply (CDA)
Carrier storage racks
Others on request
Configuration single- or double-end
Automation system fully automatic
Substrate feeding cassette, box, other
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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