Macquarie Equipment Trading on behalf of Micron Memory Japan, G.K. (F15)
Date of Manufacture: July 25, 2007
Currently Configured for: 300mm
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Hiroshima, Japan
Available date: Currently Available
WET 15-3DNS_SS3F2B2CLN DNS SS3F
Tool has been de-installed and is stored in an off-site warehouse.
A HARD DISK DRIVE WILL BE REMOVED FROM TOOL.
OTHER MISSING OR DAMAGED PARTS: NOT REPORTED.
No photos provided. Please inspect to collect photos.
[Chamber A]
Process : Wafer surface clean
Chuck : Vacuum Chuck
SPRAY : Soft Spray N2 10~100NL/min
Rinse :DIW/ CO2 INJENCTION ,resistivity <1MΩ
Spin DRY : 3000rpm Spin Dry only
[Chamber B]
Process : Wafer surface clean
Chuck : Vacuum Chuck
SPRAY : Soft Spray N2 10~100NL/min
Rinse :DIW/ CO2 INJENCTION ,resistivity <1MΩ
Spin DRY : 3000rpm Spin Dry only
[Chamber C]
Process : Wafer Backside clean
Chuck : Mechanical Chuck
SPRAY : Soft Spray N2 10~200NL/min
Burush : PVA Burush
Rinse :DIW/ CO2 INJENCTION ,resistivity <1MΩ
Spin DRY : 2400rpm Spin Dry only
[Chamber D]
Process : Wafer Backside clean
Chuck : Mechanical Chuck
SPRAY : Soft Spray N2 10~200NL/min
Burush : PVA Burush
Rinse :DIW/ CO2 INJENCTION ,resistivity <1MΩ
Spin DRY : 2400rpm Spin Dry only
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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