Macquarie Semiconductor and Technology on behalf of Micron Memory Japan, K.K. (F15)
Date of Manufacture: Sep 2005
Currently Configured for: To be determined
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Hiroshima, Japan
Available date: 10/28/2022
OEM | TEL | ||
Tool Model | α-303i WAVES-300 | ||
Process | TEOS | ||
Software Version (include revision #) | V2.06 | ||
System Power Rating | 200 AC 3-Phase | ||
Loading Configuration | 2 load positions for furnace or dual auto-indexer loaders | ||
Yes |
Description | |||
Tool: | |||
Process Unit:Mid-Temp. VMM-56-002 5zone / 500-1000© | Model: | ||
Controller:AGC | |||
MFC/Pressure Unit:STEC(SEC-Z500 series) | |||
Drive Mechanisms: N2, Electricity | |||
FOUP Opener:2 ports | |||
Gas System:Pure-N2, O2, TEOS | |||
Exhuast System: New type(EDWARDS Pump) | |||
*All OEM cable connecting between FAB to SubFab are require to be list out (Include length in mm) | |||
Cartridge Heater | |||
T/C for Heater Control | |||
T/C for Over temperature Protection | |||
5-P T/C for Cascade Control |
Safety: |
EMO switch |
Braker |
Missing or damaged parts: Fab15 confirmed there were no missing or damaged parts.
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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