Macquarie Semiconductor and Technology on behalf of Micron Memory Japan, G.K. (F15)
Date of Manufacture: 2003 July
Currently Configured for: 300mm
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Hiroshima, Japan
Available date: Currently Available
Tool has been de-installed and is stored in an off-site warehouse.
Other Missing or damaged parts: Not reported.
Equipment Type: Z-5
Process: Doped polysilicon
Process Condition: LP
Maximum Operating Temperature(C):850℃
N2 Load Lock:Load lock type N2 substitution
Qty. of Production Wafers: 100
Boat Operation (Handling Position): 1 Boat Type / 1 Boat Operation (B/E)
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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