Macquarie Equipment Trading on behalf of Micron Technology Taiwan, Inc. (F11)

Applied Materials VeritySEM 2

Asset ID: 207520

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Applied Materials

VeritySEM 2

SEM - Critical Dimension (CD) Measurement

Metrology Equipment

Equipment details:

Date of Manufacture: 2004

Currently Configured for: 300mm

Current Equipment Status: Available

Asset HDD not included

Location of Equipment: Taoyuan, Taiwan

Available date: Currently Available

Tool config is based on original PO, please verify tool details at tool inspection


Verity SEM I (Upgraded to Verity Sem 2)


Standard Equipment

Thermally assisted field emission electron gun

Patented electron optics (including YAP detector)

SEM autofocus and autostigmation module

3x300mm open cassette ports

Standing / Sitting operator console

3D sidewall imaging

Signal Tower

Thermal video and alphanumeric printers

Central Recipe database server (Tower type, for First in Fab)


Application Specification

METROLOGY

Repeatability: Lines & CH- L-0.45nm CH-0.55nm; Slope Angle STI/DD/Litho- 1deg/1deg/1deg; Height STI/D.Dam./Litho- 10nm/10nm/17nm

Reproducibility: Lines & CH L-0.45nm CH-0.55nm; Slope Angle STI/DD/Litho- 1deg/1deg/1deg; Height STI/D.Dam./Litho- 10nm/10nm/17nm

Matching: Lines & CH 0.9nm


IMAGING

Image resolution: 1.65nm @ 800,0 V

Side wall imaging: 15 degrees tilt at 4 directions

HAR imaging: 1:30 features

ABW: 10.5nm 

Accelerating Voltage: 0.2kV to 2.5kV, Extraction V. up to 4KV

Probe Current: 5pA - 500pA


System Performance

Throughput

5 sites/wafer: Lines/Spaces 65 WPH; Slope/Height 13 WPH

20 sites/wafer: Lines/Spaces 33 WPH

MTBF: 1000 hours

MTTR: 4 hours

MTBA: 24 hours

Availability: 0.95


Footprint

4x200 & 4x150 OC: w/o Service Area 4.24 sqm; 7.14 sqm

3x200 SMIF: w/o Service Area 4.61 sqm; w/ Service Area 7.40 sqm

2x300 FOUP: w/o Service Area 5.15 sqm: w/ Service Area 7.48 sqm

3x300 FOUP: w/o Service Area 6.21 sqm; w/ Service Area 8.34 sqm


Wafer Particle Contamination

Front 0.09um particles: 25 PWP/wafer (with mini environment) 

Front 0.2um particles: 5 PWP/wafer (with mini environment) 

Back 0.2um particles: 3000 PWP/wafer (with mini environment) 


Carbonization: 0.05nm per visit  


Equipment Parameters

Wafer size: 150mm, 200mm, 300mm

Optical magnification 16x, 220x (FOV: 450mm - 6000mm)

SEM magnifications: 1000x to 400,000x (100mm - 0.25mm)

Stage: 300mm/s with continuous motion trackball


Damage/Missing parts list

Please inspect tool to reconfirm

Dry pumps and customer provided items not included on sales

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The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.


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