Macquarie Semiconductor and Technology on behalf of Micron Technology Taiwan, Inc. (F11)

Applied Materials (AMAT) Reflexion - Dielectric

Asset ID: 28213

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Applied Materials (AMAT)

Reflexion - Dielectric

Dielectric CMP

CMP Equipment

Equipment details:

Date of Manufacture: 2003

Currently Configured for: 300mm

Current Equipment Status: Available

Asset HDD not included

Location of Equipment: Taoyuan City, Taiwan

Available date: Currently Available

Tool config is based on original PO, please verify tool details at tool inspection


Base System

Reflexion: 4 head, 3 platen polishing system. Dry in Dry out.

Polisher Skins: Clear P1, P2, P3, and P4: Non-4910 compliant.

Gap Wash: 120 degree nozzles(Fan type)

Load Cup Wafer Exchanger: Machined SST rings

Nova 3090 Ready: None

Monitor 1 Location: Cart

Monitor 2 Location: None

Light Tower: Factory Interface and Polisher Sides


Software

LK Software: Reflexion VMIC rp3B6.5_31

Factory Interface: fB4.20_14 beta

ISRM / RTPC: N/A

RTPC: N/A

Interface "A": N/A

Nova 3090: N/A

Wafer to Wafer iAPC: N/A

Within Wafer iAPC: N/A


Factory Interface

FI/wet robot: Kawasaki

WIP Delivery Type: OHT/manual delivery

FOUP: N/A

OHT Light Curtain: NA

E84 PI O Sensors and Cables: UPPER E84 SENSORS & CABLES

E99 Carrier ID: N/A

Docked E99 Reading Capability: N/A

Docking Flange Shield: N/A

Frame Configuration: N/A

Load Ports: TDK TAS300

Load Port Operator Interface: STANDARD

Load Port Types: ENHANCED 25 WAFER FOUP

Operator Access Switch: Yes


Platen 1

Platen Type: STANDARD (<= 200 RPM)

Endpoint: N/A

Endpoint: N/A

High Pressure Rinse Flow Meter: 0-5 L/min

Rinse Arms: High Pressure/Flow

Flow Meter: 50-500 ml/min

Temperature Control: Platen Cooling Water


Platen 2

Platen Type: STANDARD (<= 200 RPM)

Endpoint: N/A

Endpoint: N/A

High Pressure Rinse Flow Meter: 0-5 L/min

Rinse Arms: High Pressure/Flow

Flow Meter: 50-500 ml/min

Temperature Control: Platen Cooling Water


Platen 3

Platen Type: STANDARD (<= 200 RPM)

Endpoint: NA

Endpoint: N/A

High Pressure Rinse Flow Meter: 0-5 L/min

Rinse Arms: High Pressure/Flow

Flow Meter: 50-500 ml/min

Temperature Control: Platen Cooling Water


Polisher

Polisher Technology: SLURRY AND PAD

Polishing Head: 5-Zone Contour CIP

Cross Break: N/A

Pad Wafer Loss Sensor: DARK PAD SENSOR

InterPlaten Clean: NO

ISRM Laser Key Switch: Yes

Slurry Delivery System: 2 x 6 CLC SDS

Head 1 Power Cable: 0150-16277

Head 2 Power Cable: 0150-16278

Head 3 Power Cable: 0150-16279

Head 4 Power Cable: 0150-16280

Head 1 Encoder Cable: 0150-16281

Head 2 Encoder Cable: 0150-16282

Head 3 Encoder Cable: 0150-16283

Head 4 Encoder Cable: 0150-16284

G4+ UPA: MKS

G4+ UPA: MKS


Cleaner Meg

MEGASONICS: One chem direct feed (FM)

Transducer: Yes

Chemical 1: 1000 ml/min

Chemical 2: N/A


Brush Box 1

Brush LDM Type: One chem direct feed (FM)

Chemical 1: 1000 ml/min

Chemical 2: N/A

Brush Box Level Spacer: N/A

Brush Box Shaft: N/A

Toe In: N/A

Slow drain: N/A


Brush Box 2

Brush LDM Type: One chem direct feed (FM)

Chemical 1: 1000 ml/min

Chemical 2: N/A

Brush Box Level Spacer: N/A

Brush Box Shaft: NA

Toe In: N/A

Slow drain: N/A


Dryer Module

Dryer Type: SRD

Recovery Module: SRD

Output Station Dampner: SRD


Damage/Missing parts list

Please inspect tool to reconfirm

Dry pumps and customer provided items not included on sales

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The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.


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