Macquarie Semiconductor and Technology on behalf of Qorvo US, Inc.
Date of Manufacture:
Currently Configured for: N/A
Current Equipment Status: Available
Location of Equipment: Farmers Branch, United States
Available date: Currently Available
Mech-El Industries 827
The Mech-El/MEI 827 has been produced since 1974 and is still the bonder of choice for many of our customers. The MEI 827 may be the simplest most reliable ball bonder ever produced.
|Bonding Processes:||Thermocompression or thermosonic ball bonding using gold wire.|
|Wire sizes:|| 1 mil (25 micron) wire standard. 0.7 mil (18 micron), 2 mil (51 micron), and 3 mil (76 micron)|
|Tip Weight:||15 - 150 grams.|
|Capillary size:||0.063" x 0.375" (1.6mm x 9.5 mm) standard.|
|Heated Workstage:||Digital heat control option will regulate temperature from ambient to 300°C +/- 0.5% (dependant|
|Ultrasonics:||Uthe 10G generator with 25ST transducer standard.|
|Services:||Electrical: 110-115 VAC, 50/60Hz, 5 amps or 220-240 VAC, 50/60Hz, 2.5 amps. Air: 40 PSI (240 kPa)|
minimum, if required.
Vacuum: 20" (510 mm) Hg minimum, if required.
Width: 18" (45.7cm)
Height 17.75" (45.1cm)
Net Weight: 40 pounds (18 Kg)
*Note: Exact dimensions are dependent upon the options on the machine.
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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