Macquarie Semiconductor and Technology on behalf of Qorvo US, Inc.
Date of Manufacture:
Currently Configured for: 200mm
Current Equipment Status: Available
Location of Equipment: Farmers Branch, United States
Available date: Currently Available
Dynatex International DX III
Audit to Verify
Wafer Scriber/Breaker For Scribing & Breaking of up to 4” Wafers Chip Free™ Breaking Mechanism Uses Impact Breaking System
Minimum Die Size: 0.005” Square (125µ)
Wafer Thickness Range: 0.004” (100µ) to 0.039” (975µ)
CCD Camera Alignment System
Internal PC Control System / DOS Operating System
Facilities Required: Input Voltage: 115VAC, 60Hz, 5A CDA or N2: 60-85 PSIG, 0.5 CFM
Vacuum: 15-28 In. Hg, 0.5 CFM
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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