Macquarie Equipment Trading on behalf of Macquarie (Asia) Pte Ltd. Taiwan Branch - UMC

Tokyo Ohka Kogyo Co., Ltd. TWM8233

Asset ID: 68782

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Tokyo Ohka Kogyo Co., Ltd.

TWM8233

Fully-Automated Wafer Bonder

Wafer Bonding

Equipment details:

Date of Manufacture: 2013.03

Currently Configured for: To be determined

Current Equipment Status: Available

Location of Equipment: Hsinchu 300, Taiwan

Available date: Currently Available

Complete New Equipment


200mm Zero Newton coater and bonder system :TWM8233

Main Body for 8 inch wafer

Carrier Station : 2

Support Stocker :2

Transfer Robot : 2

Cooling Plate : 2

Spin cup unit : 2

Baking Plate : 3

Cooling Area : 2

Pre Aligner : 1

Bonding Unit :1 ( Max bond force is 500kg )

Electrical Box : 1

Operation Display Rack : 1

Chemical Cabinet :1


※ Inspect to confirm configuration and condition. EQUIPMENT DETAILS:

※ Since the tool didn’t setup so there is no Manuals for this tool. Possible to discuss after tool set up and on side training service ※ Bonding chamber*1

※ Design is for temporary bonding with adhesive coater

※ Support adhesive bonding.

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The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.


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