Macquarie Semiconductor and Technology on behalf of Micron Memory Taiwan Co., Ltd. (MTB)

Zen Voce Corporation BM388


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Asset ID: 41200

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Zen Voce Corporation


Solder Ball Mount

Ball Mount

Equipment details:

Date of Manufacture:

Currently Configured for: N/A

Current Equipment Status: Available

Asset HDD not included

Location of Equipment: Taichung City, Taiwan

Available date: Currently Available


Audit to verify

================= OEM Feature =================

Feature :

  • High Speed Linear Pick & Place Robots
  • Theta axis on stage for precise flux and ball position
  • Application both of carrier & substrate type ball mount process
  • Z axis height precise position by motorized lifter
  • Substrate placement press module
  • Max 15mm warpage substrate available
  • Substrate orientation inspection thru vision (PMI, Carrier type)
  • Rock & fill ball bin module
  • Tool damage protection feature using Quickstop
  • Highly flexible system with user friendly GUI
  • Variable speed control for Flux & Ball sweep with software parameter setting (beneficial for process evaluation)


Length min 150min ~ max 325mm

Width min 50min ~ max 170mm

Placement area (Length) max 320mm

Placement area (Width) max 130mm

Thickness min 1mm ~ max 8mm

Ball size min 0.30mm ~ 0.76mm and above

Ball Pitch min 0.50mm ~ 1.50mm and above


Length min 150min ~ max 300mm

Width min 50min ~ max 100mm

Placement area (Length) min 140mm ~ max 290mm

Placement area (Width) min 45mm ~ max 95mm

Thickness min 0.5mm ~ max 2mm

Ball size min 0.15mm ~ 0.76mm and above

Ball Pitch min 0.30mm ~ 1.50mm and above

Achievable number of balls per mount cycle 60,000 balls

PMI resolution 0.020mm/pixel (Option 0.014mm/pixel)

Vision accuracy +-0.03mm@3sigma

Ball placement accuracy 1/3 ball offset

The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.

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