Macquarie Semiconductor and Technology on behalf of Micron Technology, Inc. (VA)
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PVD (Physical Vapor Deposition)
Date of Manufacture: 2011-01-01
Currently Configured for: 300mm
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Manassas, United States
Available date: Currently Available
Multi-Chamber Sputtering System
ENTRON-EX W300T Triple Gun Cathode Tool
Software Version : Ver. 332-A2
System Power Rating: 3 Phase,AC200V,80A/102A/63A 50/60 Hz
Loading Configuration: 3 Load Ports
Chm Position F1 PVD Sputter ( 3C ) AR , N2
Chm Position F2 PVD Sputter ( 3C ) AR , N2
Chm Position F4 PVD Sputter ( 3C ) AR , N2
Chm Position B1/B2 Degas Chambers
F1,F2,F4 - PVD Chambers ( 3C Sputter process )
B1/B2 - Degas Chambers (Remove moist layer )
System is not configured with substrate bias.
System utilizes AE MDX 1K
The wafer sensor and the lifter bellows are not installed. The inverter board and heater jacket is installed, but defective.
|
Chamber |
Part # |
Description |
Location |
Qty |
|
F2 |
101282105 |
bad inverter board |
MB II Card Stack in I/F box. |
1 |
|
F2 |
100069095 |
Wafer Lift Bellows |
Shield Box |
1 |
|
F2 |
100602864/100011147 |
Faulty Pump Heater Jacket |
Turbo Pump |
1 |
|
Fx |
101442899 |
Wafer Sensor |
Bottom of Fx chamber |
1 |
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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