Disco Hi-Tec DFL7361

Equipment details:

Date of Manufacture: 2017

Currently Configured for: 300mm

Current Equipment Status: Available

Asset HDD not included

Location of Equipment: Taichung City, Taiwan

Available date: Currently Available

Configuration. Audit to verify.

The wavelength: 1342nm

Laser current hour used: 22032.32hrs (information provided at 2020 Jun 9th)

Tool is included 2 inch kits, no any other accessories and sub-system is included with tool

Disco Model DFL7361 Fully-Automatic Stealth Dicing ( Laser saw in the internal part of wafer )

Technical Data:

· Accommodates up to 12-inch wafers

· Automatic handling

· Auto-alignment

· High speed X axis capable of 1000mm/sec

· 380° rotational theta axis

· Hard disk allows the user to store 1000 different device programs

· Window XP based Graphical User Interface

· Touch panel display

· SDE01 Laser Engine

· Standard IR Camera

· SDE06 Laser Head              

· IR Camera for full Thick wafers up to 1mm (replaces standard IR camera)                      

· 25 Character Recipe name                  

· SECS GEM                                

· Additional Host Monitor, keyboard stand, and cable port addition    

· Wafer ID reader                          

· Clean Unit Hepa Processing Section

· Clean Unit Hepa Transfer Section

· Frame Handling and Wafer Handling Option

· Vacuum Retention and SG140154-0.

· SD Through Tape in Manual Mode.

Wafer transfer (Standard specification) : ①The workpiece is withdrawn from the cassette by the wafer pick and transferred to the load table ②The workpiece is transferred to the chuck table by the rotation arm → laser processing ③The workpiece is transferred to the unload table by the rotation arm ④The workpiece is returned to the cassette by the frame pick

Damage/Missing parts list

Please inspect tool to reconfirm