Macquarie Semiconductor and Technology on behalf of Micron Technology, Inc. (VA)

Toray Engineering Co., Ltd. FC3000

Asset ID: 209127

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Toray Engineering Co., Ltd.

FC3000

Flip Chip Bonder

Bonder

Equipment details:

Date of Manufacture:

Currently Configured for: N/A

Current Equipment Status: Available

Asset HDD not included

Location of Equipment: Manassas, United States

Available date: 8/5/2021

WET 06-DNS_FC30_SPM2022 DNS FC30 SPM2022


Toray FC3000 Flip Chip Bonder

Substrate size : 8”,12” t=0.725-1(㎜)

Chip size (mm): Thermo-compression bonding : 3–20 mm long x 3–20 mm wide (t=0.05–1.0 mm)

Alignment accuracy (3 σ) : ±2μm(X,Y)

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The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.


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