Macquarie Semiconductor and Technology on behalf of Analog Devices, Inc.

West Bond, Inc. 7200CR

Asset ID: 208823

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West Bond, Inc.

7200CR

Die Bonder

Bonder

Equipment details:

Date of Manufacture:

Currently Configured for: To be determined

Current Equipment Status: Available

Location of Equipment: Milpitas, United States

Available date: Currently Available

West Bond, Inc. Manual Epoxy Die Bonder, Model 7200CR-79, with Olympus SZ51-60 microscope


STANDARD SPECIFICATIONS:

CONTROL LOGIC: Motorola 68000 Microprocessor

MEMORY: 256KB RAM

DEVICE STORAGE: Single Device

DISPLAY: 40 Character, 4 Line LCD

Z-ENCODER RESOLUTION: 0.001”

TOOL Z RANGE: 0.625”

THROAT DEPTH: 5.25”

BOND FORCE RANGE: Adjustable, 5 – 75 grams

ESD PROTECTION: Protection against Electrostatic Discharge

PICK-UP TOOL LENGTH: 0.625”

EPOXY DISPENSE NEEDLE LENGTH: 0.400”

EPOXY DISPENSE NEEDLE BORE: 0.006” – 0.073”

MICROMANIPULATOR: Counterbalanced, single lever X-Y-Z / 8:1 ratio

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The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.


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