Macquarie Semiconductor and Technology on behalf of Micron Technology Utah, LLC
PVD (Physical Vapor Deposition)
Date of Manufacture: 5/2017
Currently Configured for: 300mm
Current Equipment Status: Incoming
Asset HDD not included
Location of Equipment: Lehi, United States
Available date: Currently Available
| OEM | Ulvac | |||
| Tool Model | Entron EX | |||
| Process | Mat X | |||
| Software Version | Ver.357-15 | |||
| System Power Rating | 208 AC 60 Hz 3-Phase | |||
| Loading Configuration | 3 Load Ports | |||
| Description | Chemicals / Gases Used | |||
| Chm/Unit Position F1 | Normal Chamber | Argon, Nitrogen, Carbon | ||
| Chm/Unit Position F4 | Normal Chamber | Argon, Nitrogen, Carbon | ||
| Chm/Unit Position R1 | Mat X Chamber | Argon, Mat X Material | ||
| Chm/Unit Position R2 | Normal Chamber | Argon, Tungsten | ||
| Chm/Unit Position R3 | Normal Chamber | Argon, Tungsten | ||
| Chm/Unit Position R4 | Mat X Chamber | Argon, Mat X Material | ||
| Chm/Unit Position B1 | Anneal | Argon | ||
| Chm/Unit Position B2 | Anneal | Argon |
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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