Macquarie Semiconductor and Technology on behalf of Micron Memory Japan, K.K. (F15)

LAM Research 2300 Exelan Flex 45

Asset ID: 211044

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LAM Research

2300 Exelan Flex 45

Dielectric Etch

Etch/Ash/Clean - Plasma Processing

Equipment details:

Date of Manufacture: 2007

Currently Configured for: To be determined

Current Equipment Status: Available

Asset HDD not included

Location of Equipment: Hiroshima, Japan

Available date: 4/7/2023

OEM  LAM
Tool Model  Exelan ABE 2300
Process  Oxide
Software Version (include revision #) 1.8.4_SP5-HF1
System Power Rating  200 AC 3-Phase
Loading Configuration  3 load ports



     
   Vendor Chm ModelChemicals / Gases Used (not to use Micron Proprietary names)
Chm/Unit Position   1  Xlan ABEC4F8,CF4,O2,Ar,CO,CH3F,CHF3,Xe,C4F6,CH2F2,N2 
Chm/Unit Position   2  Xlan ABEC4F8,CF4,O2,Ar,CO,CH3F,CHF3,Xe,C4F6,CH2F2,N2 
Chm/Unit Position   3  Xlan ABEC4F8,CF4,O2,Ar,CO,CH3F,CHF3,Xe,C4F6,CH2F2,N2 


Section 4. Missing / Defective/ Cannibalized Parts: 
DescriptionMissing (Qty)Defective (Qty)Cannibalized (Qty)
N/A   



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The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.


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