Macquarie Semiconductor and Technology on behalf of Micron Technology Taiwan, Inc. (F11)
Date of Manufacture: 2005
Currently Configured for: 300mm
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Taoyuan, Taiwan
Available date: Currently Available
Tool config is based on original PO, please verify tool details at tool inspection
SW: Nanoscope 6.26R2sr1
Wafer Size: 300mm round (SEMI std.) , notched wafer.
Tip Type: Nanotools-MC90/70 next generation
Carrier: E99 Carrier ID Reader.
Facilities: Power: 100 - 120VAC 1P-3W, 50/60 Hz, 10k Amp breaker; CDA: 110 psi; GN-2: 60 psi; Vw: -650 mmHg
Communication interface:
Manufactured to I300I guidelines
Compliant to E84 Parallel I/O Carrier Transfer, E87 Carrier Management, E40 Processing Management, E94 Control Job Management
Computer: Intel Pentium 4 CPU 2.6GHz
RAM:1.00GB
Microsoft Windows XP Version 2002 Service Pack 2"
Robot type: Brooks, ABM407B-1-S-CE-S293
Prealigner: Brooks, PRE-300BU-I-C-S2
LOADPORT: ASD Handler GEN3 (ASYST); ASYST ISO load ports (2 Ports); Break The Beam Mapper (ASYST)
High and low mag cameras: Included
Light Tower: 4 Color Light Tower (RYGB)
Tip cassette: Two standard tip cassettes (TXCST-3DBLK & TXCST-3DCLR) that hold up to 24 tips each
Patented TappingMode 3-D and 2-D profiled measurements: Included
Patented DTMode AFM: Included
NanoScope IVm Metrology Control Station and NanoScope Version: Included
100mm 2D-Profiling includes 262,000 points/line: 25mm Scan Length
>45µm x 45µm 3D-metrology includes 4K Data Points: Included
Vertical range of 8.0µm: Included
Integrated vibration isolation platform: Included
Recipe-driven data acquisition and report generation: Included
Up to 200µm/second scanning (2D-Profile & 3D-Area Data): Included
Single mini environment and integrated micro environment for ISO class 2 operation: Included
HSMS Semi-E30 GEM software interface: V. 5A, NO: 004-910-000
NanoScript Automation Software: Included
TipX Automatic Tip Exchange: Included
VLSI Calibration Standard: VLSI 9 nm 18nm; VLSI 80nm; VLSI 450nm
Ultra-Flat ceramic wafer chuck: Included
S2-0200, S8-0999, and CE compliant : Included
Damage/Missing parts list
Please inspect tool to reconfirm
Dry pumps and customer provided items not included on sales
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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