Macquarie Semiconductor and Technology on behalf of Micron Memory Taiwan Co., Ltd. (F16)

Accretech/TSK UF3000

Asset ID: 207209

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Production Wafer Prober

Wafer Prober

Equipment details:

Date of Manufacture: 2006

Currently Configured for: 300mm

Current Equipment Status: Available

Asset HDD not included

Location of Equipment: Taichung City, Taiwan

Available date: Currently Available


Other Missing or damaged parts: Not reported. Please inspect to confirm.

Loader Type: TSK

Number of Loaders: 1 Single loadport

Cassette ID Reader: Yes, KEYENCE BL-601HAC1

Chuck Size: 12"

Chuck Top Material: NICKEL COATING

Low Temp Chuck: YES, Type: ARTS-LC12

Chuck Temperature Range: -40~150℃

Temperature Unified Chuck Option: Yes

Low Noise Chuck Option: No

External Chiller Unit: Yes, SHI SCU500S

High Force Z Drive: No

Auto Probe to Pad Alignment: Yes

Needle Mark Inspection: Yes

Fail Mark Inspection: Yes

Surface Wafer ID OCR: Yes, INSIGHT 1700 series

Wafer ID Barcode Reader: No

Needle Cleaning Option (Double Brush): No

Auto Needle Height and Align: Yes, Auto/Manual card change

Soak Time Option: Yes

Probe Card Changer: Yes

3-64 Multi-site Probing: 1~1024


RS232 Interface: Yes

RF Tag: No

Software Version: S8.39.CM

P/C unit no.: ACCT-072

User ID / Password: Default

Integrated Printer: No

Manipulator: Hinge, MHF6000

Test System Interface: Micron C1D (tester is not included)

Tool is a Cold temperature range prober.

X,Y Overall Accuracy:±2.0µm (Temp Stability ±1℃

X,Y Stage Accuracy:±1.0µm

Z Axis Stroke(Applicable stroke):37mm

Z Axis Control Accuracy:±2µm

Stage Durability:200kgf

Hot&COLD chuck


Temp. Range:-40 to 150℃

Tool is a right SIDE LOADER.

UF3000 Standard Feature

Overall Accuracy Within 2 µm

Wafer Size 8", 12"

X/Y axis Probing Area ±170 mm (X/Y axis Probing Area)

X/Y axis Maximum Speed X axis 300 mm/s Y axis 230 mm/s

Z axis Full Stroke 37 mm

Z axis Maximum Speed 30 mm/s

θ axis Rotation Range ±5 deg.

Fine Alignment CCD ITV Image Processing

Loader Cassette Mounts 1 (2nd cassette with option)

Loader Wafer Handling Robot Arm / Backside Holding

Hard Disk 3.5" 20GB (1 unit standard)

Floppy Disk 3.5" 2HD / 2DD (1 unit standard)

MO 230 / 540MB (1 unit standard)

Display 12.1" TFT Color LCD

Power Consumption Less than 2kVA

Air Supply Source Pressure 0.6 MPa or more

Air Supply Consumption Approximately 0.1 liters / wafer

Vacuum Supply Less than -80 kPa, 30 liters / minute

Dimensions 1508W × 1587D × 987 H mm

Weight 1500 kg (Standard)

Product images

The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.

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