Macquarie Semiconductor and Technology on behalf of Micron Memory Taiwan Co., Ltd. (MTB)
The images and data contained herein is owned by Macquarie and is intended for use only by potential purchasers of goods shown herein. Except for such permitted usage, no other use of the images and data is permitted and such images and data shall not be exhibited or shown in any websites or social media or for any commercial purposes without Macquarie’s written permission. Therefore, no seller of goods like the goods shown herein has any right or authority to show or exhibit any images or data shown herein.
Date of Manufacture:
Currently Configured for: N/A
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Taichung City, Taiwan
Available date: Currently Available
BASTD ZEN ZVM388P
Audit to verify
================= OEM Feature =================
Feature :
Carrier
Length min 150min ~ max 325mm
Width min 50min ~ max 170mm
Placement area (Length) max 320mm
Placement area (Width) max 130mm
Thickness min 1mm ~ max 8mm
Ball size min 0.30mm ~ 0.76mm and above
Ball Pitch min 0.50mm ~ 1.50mm and above
Substrate
Length min 150min ~ max 300mm
Width min 50min ~ max 100mm
Placement area (Length) min 140mm ~ max 290mm
Placement area (Width) min 45mm ~ max 95mm
Thickness min 0.5mm ~ max 2mm
Ball size min 0.15mm ~ 0.76mm and above
Ball Pitch min 0.30mm ~ 1.50mm and above
Achievable number of balls per mount cycle 60,000 balls
PMI resolution 0.020mm/pixel (Option 0.014mm/pixel)
Vision accuracy +-0.03mm@3sigma
Ball placement accuracy 1/3 ball offset
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
Get in touch
Ask about our equipment solutions, ranging from Macquarie equipment inventory sales, sourcing programs, surplus disposition options, and direct equipment purchases.
