Macquarie Semiconductor and Technology on behalf of Qorvo US, Inc.
Date of Manufacture:
Currently Configured for: N/A
Current Equipment Status: Available
Location of Equipment: Farmers Branch, United States
Available date: Currently Available
Palomar Technologies 3500 III
Audit to verify
The Model 3500-III is designed for fully automatic, precision microelectronics assembly. The flexible, computer-controlled workcell performs up to three channels of adhesive dispense, component placement, eutectic die attach, and flip chip operations over a spacious 710-in > Model 3500-III Die Bonder 2 work area.
The honeycomb core machine base provides vibration damping and thermal settling response superior to granite. Submicron axis resolution yields typical placement accuracies of 0.5 mil (12.7 ѵm) with fluids, down to 0.2 mil (5 ѵm) using Pulsed Heat Eutectic processes. The cantilever design permits unobstructed, open access on three sides for setup and an infrared light curtain ensures operator safety during production.
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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