Hermes Microvision (HMI) eP3 XP

Equipment details:

Date of Manufacture: 2014

Currently Configured for: 300mm

Current Equipment Status: Available

Asset HDD not included

Location of Equipment: Taoyuan City, Taiwan

Available date: Currently Available

Process: SEMINSP

Tool config is based on original PO, please verify tool details at tool inspection

Tool performance report is available by request

Pixel rate 100M pixels/second

Beam current 50pA - 50nA

Landing energy 50 - 3000 eV

No.5 bias voltage - 3000 ~ 3000 eV

Minimum pixel size 3nm

Wafer Loader Unit

1.Integrated front-end,

2.dual pod 300mm FOUP.

3.Signal Tower

Computation Units

1. 2High quality flat panel display units;joystick,keyboard,mouse,DVD drives

2. GUI computer:Dual XEON CPU2.4GHZ,4GBmemory,3x320GB HDs,Windows XP operation system

3.Host computer:Dual XEON CPU2.4GHZ,4GBmemory,3x320GB HDs,Windows XP operation system

4.Firewall Computer:XEON CPU3.4GHZ,4GBmemory,3x320GB HDs,Windows XP operation system

5.Z computer:Intel i5-680 CPU3.6 GHZ,4GB memory,1x160 GB HD,Windows XP operation system

6.ADC computer: 6-core XEON CPU2.66 GHZ,24GB memory,3x2 TB and 1x160GB HDs, Linux operation system

7.Image Computer: 6-core XEON CPU2.66 GHZ,16GB memory,2x160 GB HDs, Linux operation system

8.3xClient Computers: 6-core XEON CPU2.66 GHZ,8GB memory,1x160 GB HDs, Linux operation system

9. GLM Computer: 6-core XEON CPU2.66 GHZ,8GB memory,1x160 GB HDs, Linux operation system

Communications Capability Etherent port using TCP/IP,Internet connectivity and remote control

System Software Ver.2.9.7.3 "Easy to use GUI,Recipe setup wizard; system calibration, diagnostics and monitoring,Job queuing,

sample load/unload control,Automation support;Hot spot monitoring,CDU measurement;

Klarf defect auto-reconfirmation,SuperNovaTMD2DB engine connectivity support"

System Hardware Ver.77-600-3000003-00

1.Main inspection chamber

2.loadlock

3.Optics alignment subsystem

4.300mm X-Y stage and motion controller

5.Z stage

6.E-chuck wafer holder and controller

7.Active damping subsystem

8.System protection module

9.High Vacuum pumping system and controllers

10.PDU with A/C and D/C power supply modules

11.Line conditioner and UPS unit

12.Image scan and acquisition subsystem

13.Electron source HV power sub-system

14.Stage HV power sub-system

15.Pre-charging subsystem

Electron Source and Column Assy

1.TFE emission electron beam source subsystem

2.Electron-optics Column subsystem

3.High-speed SE detection and amplification subsystem

Standalon User Console

Automation Kit

Light Curtain

Safety EMO buttons(x4), Safety interlocks

Documentation eP3 pre-installation documentation, eP3 user manual

Dry pump EDWARDS EPX180LE (Not included with tool

Damage/Missing parts list

Please inspect tool to reconfirm

Dry pumps and customer provided items not included on sales