Macquarie Semiconductor and Technology on behalf of Micron Technology Taiwan, Inc. (F11)
Date of Manufacture: 2014
Currently Configured for: 300mm
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Taoyuan City, Taiwan
Available date: Currently Available
Process: SEMINSP
Tool config is based on original PO, please verify tool details at tool inspection
Tool performance report is available by request
Pixel rate 100M pixels/second
Beam current 50pA - 50nA
Landing energy 50 - 3000 eV
No.5 bias voltage - 3000 ~ 3000 eV
Minimum pixel size 3nm
Wafer Loader Unit
1.Integrated front-end,
2.dual pod 300mm FOUP.
3.Signal Tower
Computation Units
1. 2High quality flat panel display units;joystick,keyboard,mouse,DVD drives
2. GUI computer:Dual XEON CPU2.4GHZ,4GBmemory,3x320GB HDs,Windows XP operation system
3.Host computer:Dual XEON CPU2.4GHZ,4GBmemory,3x320GB HDs,Windows XP operation system
4.Firewall Computer:XEON CPU3.4GHZ,4GBmemory,3x320GB HDs,Windows XP operation system
5.Z computer:Intel i5-680 CPU3.6 GHZ,4GB memory,1x160 GB HD,Windows XP operation system
6.ADC computer: 6-core XEON CPU2.66 GHZ,24GB memory,3x2 TB and 1x160GB HDs, Linux operation system
7.Image Computer: 6-core XEON CPU2.66 GHZ,16GB memory,2x160 GB HDs, Linux operation system
8.3xClient Computers: 6-core XEON CPU2.66 GHZ,8GB memory,1x160 GB HDs, Linux operation system
9. GLM Computer: 6-core XEON CPU2.66 GHZ,8GB memory,1x160 GB HDs, Linux operation system
Communications Capability Etherent port using TCP/IP,Internet connectivity and remote control
System Software Ver.2.9.7.3 "Easy to use GUI,Recipe setup wizard; system calibration, diagnostics and monitoring,Job queuing,
sample load/unload control,Automation support;Hot spot monitoring,CDU measurement;
Klarf defect auto-reconfirmation,SuperNovaTMD2DB engine connectivity support"
System Hardware Ver.77-600-3000003-00
1.Main inspection chamber
2.loadlock
3.Optics alignment subsystem
4.300mm X-Y stage and motion controller
5.Z stage
6.E-chuck wafer holder and controller
7.Active damping subsystem
8.System protection module
9.High Vacuum pumping system and controllers
10.PDU with A/C and D/C power supply modules
11.Line conditioner and UPS unit
12.Image scan and acquisition subsystem
13.Electron source HV power sub-system
14.Stage HV power sub-system
15.Pre-charging subsystem
Electron Source and Column Assy
1.TFE emission electron beam source subsystem
2.Electron-optics Column subsystem
3.High-speed SE detection and amplification subsystem
Standalon User Console
Automation Kit
Light Curtain
Safety EMO buttons(x4), Safety interlocks
Documentation eP3 pre-installation documentation, eP3 user manual
Dry pump EDWARDS EPX180LE (Not included with tool
Damage/Missing parts list
Please inspect tool to reconfirm
Dry pumps and customer provided items not included on sales
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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