Macquarie Semiconductor and Technology on behalf of Micron Technology Taiwan, Inc. (F11)

Veeco Instruments Inc. Dimension X1D

Asset ID: 205779

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Veeco Instruments Inc.

Dimension X1D

Atomic Force Microscope (AFM)

Metrology Equipment

Equipment details:

Date of Manufacture: 2005

Currently Configured for: 300mm

Current Equipment Status: Available

Asset HDD not included

Location of Equipment: Taoyuan, Taiwan

Available date: Currently Available

Tool config is based on original PO, please verify tool details at tool inspection

SW: Nanoscope 6.26R2sr1

Wafer Size: 300mm round (SEMI std.) , notched wafer.

Tip Type: Nanotools-MC90/70 next generation 

Carrier: E99 Carrier ID Reader.

Facilities: Power: 100 - 120VAC 1P-3W, 50/60 Hz, 10k Amp breaker; CDA: 110 psi; GN-2: 60 psi; Vw: -650 mmHg

Communication interface: 

Manufactured to I300I guidelines 

Compliant to E84 Parallel I/O Carrier Transfer, E87 Carrier Management, E40 Processing Management, E94 Control Job Management 

Computer: Intel Pentium 4 CPU 2.6GHz


Microsoft Windows XP Version 2002 Service Pack 2"

Robot type: Brooks, ABM407B-1-S-CE-S293

Prealigner: Brooks, PRE-300BU-I-C-S2

LOADPORT: ASD Handler GEN3 (ASYST); ASYST ISO load ports (2 Ports); Break The Beam Mapper (ASYST)

High and low mag cameras: Included

Light Tower: 4 Color Light Tower (RYGB)

Tip cassette: Two standard tip cassettes (TXCST-3DBLK & TXCST-3DCLR) that hold up to 24 tips each

Patented TappingMode 3-D and 2-D profiled measurements: Included

Patented DTMode AFM: Included

NanoScope IVm Metrology Control Station and NanoScope Version: Included

100mm 2D-Profiling includes 262,000 points/line: 25mm Scan Length

>45µm x 45µm 3D-metrology includes 4K Data Points: Included

Vertical range of 8.0µm: Included

Integrated vibration isolation platform: Included

Recipe-driven data acquisition and report generation: Included

Up to 200µm/second scanning (2D-Profile & 3D-Area Data): Included

Single mini environment and integrated micro environment for ISO class 2 operation: Included

HSMS Semi-E30 GEM software interface: V. 5A, NO: 004-910-000

NanoScript Automation Software: Included

TipX Automatic Tip Exchange: Included

VLSI Calibration Standard: VLSI 9 nm 18nm; VLSI 80nm; VLSI 450nm

Ultra-Flat ceramic wafer chuck: Included

S2-0200, S8-0999, and CE compliant : Included

Damage/Missing parts list

Please inspect tool to reconfirm

Dry pumps and customer provided items not included on sales

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The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.

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