Macquarie Semiconductor and Technology on behalf of Micron Japan, Ltd.
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Date of Manufacture: June 2011
Currently Configured for: To be determined
Current Equipment Status: Available
Asset HDD not included
Location of Equipment: Hiroshima, Japan
Available date: Currently Available
PROBE 15-3ESI_9850_TRIM ESI TRIM
Tool has been de-installed and is stored in an off-site warehouse.
Feature of ESI 9850
Minimum Spot Size: (1/e2): 1.5 um
Accuracy: 0.15 um
Wavelength: 1.0 um - Tailored Pulse
Laser rep. rate: 150 kHz
Maximum cut velocity: 400 mm / sec
The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.
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