Macquarie Semiconductor and Technology on behalf of Micron Technology Taiwan, Inc. (F11)

KLA-Tencor Corp. 2820

Asset ID: 79167

Print spec sheet

KLA-Tencor Corp.

2820

Wafer Inspection Equipment

Metrology Equipment

Equipment details:

Date of Manufacture: 2010

Currently Configured for: 300mm

Current Equipment Status: Available

Asset HDD not included

Location of Equipment: Taoyuan City, Taiwan

Available date: Currently Available

Process: BTFLDINSP

TOOL WAS DEINSTALLED BY KLA, INCLUDES SHIPPING KIT.

Tool config is based on original PO, please verfiy tool details at tool inspection


SW 10.6.622.1.3

Wafer Size 300 mm (12?)


Carrier

Carrier I.D. HW options

   Hermos (2 CID devices)

   Advantag (2 CID devices)

   Keyence BCR SingleWire (2 CID devices)


Interlocks

Safety Interlock for open panel

Safety Interlock for lamp


Facilities

Power: 2V4W-N, 24KW

Vw:25 in Hg

CDA:13.6 Sft3/min

P-N2:12.2 Sft3/min

Exhaust:263 ft3/min

Exhaust:3000 ft3/min

Exhaust:2600 ft3/min


Integrated Mini-Environment. Included


FEC computer system with the following minimum features:

IntelRPentiumR4 CPU 3.00GHz

2GB memory (RAM)


DELL computer system with the following minimum features

IntelRXeon? CPU 3.4GHz

2.48GB memory (RAM)

DVD - ROM

mouse

Keyboard


HSMS / GEM SEMI E37 compliant Ethernet interface

HSMS (E5 / E30 / E37)

GEM/SECS Automation Interface (E4 / E5 / E30)

SEMI E84

SEMI E116

Hokuyo Sensors for use with:

   Overhead Transport (OHT)

   Remote Guided Vehicles (RGV/AGV)

   Auto Switch for Dual Use Environments

Basic Automation Package ? E39, E87, E90 (Carrier Management/Wafer Tracking)

Advanced Automation Package E40, E94 (Process Job, Control Job)


Software  

Windows 2000 Operating System SP4

Wafer Inspection system version 10.6.622.1.3

IDM

InlineADC

ITF

Load Port UI

MDAT

Mixed Mode

NFS Data Transfer

OME

OSTS

Patch Images

RICO

Spatial Population Analysis :

1. Power Options 

  Patch Images 64x64

  PixelPerfect

  RBB

  RBMT

  Sensitivity Tuner

  NPA

2. Photo Option

  NPA

  Partial Die


Interface

Data Transfer

   DVD-R

   Ethernet


Hardware optic 

DUV Blue Band\Broad Band\Deep Band Pixels (120nm, 160nm, 200nm, 230nm, 80nm, 90nm, Core, Quarter Speed Core)

UV G-Line/I-Line Pixels(120nm, 160nm, 200nm, 230nm, 80nm, 90nm, Core, Quarter Speed Core)

UV GHI-Line Pixels(160nm, 200nm, 230nm, 80nm, 90nm, Core, Quarter Speed Core) 

Edge Contrast Plus

HighPerformanceEdgeContrast

Bright Field

1DECVertical

1DECHorizontal

LowSigma

HPS-F

HPS-M

VPS-F

VPS-M

Bright Field


Damage/Missing parts list

Please inspect tool to reconfirm

Dry pumps and customer provided items not included on sales

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Product Images

The information referenced on this page is accurate to the best of our knowledge. We do not warrant the completeness or accuracy of the information contained herein. Interested parties are encouraged to request inspection to verify equipment condition, configuration, and completeness. Any offer to purchase equipment shall be subject to our standard terms and conditions of sale.


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